Ukuhlaziywa Komzimba Okubhubhisayo
Isingeniso Sesevisi
I-GRGT ihlinzeka ngokuhlaziywa komzimba okulimazayo (i-DPA) yezingxenye ezimboza izingxenye ezingenzi lutho, amadivaysi ahlukene namasekhethi ahlanganisiwe.
Ezinqubweni ezithuthukisiwe ze-semiconductor, amandla e-DPA amboza ama-chips angaphansi kuka-7nm, izinkinga zingakhiywa kungqimba oluthile lwe-chip noma uhla lwe-um;ngezingxenye zokuvala umoya ezingeni le-aerospace ezinezidingo zokulawula umhwamuko wamanzi, ukuhlaziya ukwakheka komphunga wangaphakathi wezinga le-PPM kungenziwa ukuze kuqinisekiswe izidingo zokusetshenziswa okukhethekile kwezingxenye zokuvala umoya.
Ububanzi Besevisi
Ama-chips esekethe ahlanganisiwe, izingxenye ze-elekthronikhi, amadivayisi ahlukene, amadivayisi ka-electromechanical, izintambo nezixhumi, ama-microprocessors, amadivayisi ahlelekayo anengqondo, inkumbulo, i-AD/DA, izixhumanisi zebhasi, amasekhethi edijithali avamile, amaswishi e-analog, amadivayisi e-analog, Amadivayisi e-microwave, izinsiza zamandla, njll.
Izindinganiso zokuhlola
● Indlela yokuhlola yedivayisi ye-GJB128A-97 Semiconductor ehlukanisayo
● I-GJB360A-96 indlela yokuhlola izingxenye zikagesi nezikagesi
● I-GJB548B-2005 Izindlela zokuhlola zedivayisi ye-Microelectronic nezinqubo
● I-GJB7243-2011 Ihlola Izidingo Zobuchwepheshe Zezingxenye Ze-elekthronikhi Zamasosha.
● I-GJB40247A-2006 Indlela Yokuhlaziya Elimazayo Yomzimba Yezingxenye Ze-Electronic Yamasosha.
● QJ10003—2008 Umhlahlandlela Wokuhlola Wezingxenye Ezingenisiwe
● Indlela yokuhlola yedivayisi ye-MIL-STD-750D ye-semiconductor discrete
● Izindlela nezinqubo zokuhlola zedivayisi ye-MIL-STD-883G microelectronic
Izinto zokuhlola
| Uhlobo lokuhlola | Izinto zokuhlola |
| Izinto ezingacekeli phansi | Ukuhlola okubonakalayo kwangaphandle, ukuhlolwa kwe-X-ray, i-PIND, ukuvala, amandla etheminali, ukuhlolwa kwe-acoustic microscope |
| Into ebhubhisayo | I-laser de-capsulation, chemical e-capsulation, ukuhlaziya ukwakheka kwegesi yangaphakathi, ukuhlola okubonakalayo kwangaphakathi, ukuhlolwa kwe-SEM, amandla okubopha, amandla okugunda, amandla okunamathela, i-chip delamination, ukuhlolwa kwe-substrate, ukudaya kwe-PN junction, i-DB FIB, ukutholwa kwezindawo ezishisayo, indawo evuzayo ukutholwa, ukutholwa kwe-crater, ukuhlolwa kwe-ESD |
