Ukuhlaziywa kwe-Microstructure kanye nokuhlolwa kwezinto zokwakha ze-semiconductor
Isingeniso Sesevisi
Ngokuthuthuka okuqhubekayo kwamasekethe amakhulu ahlanganisiwe, inqubo yokukhiqiza ama-chip iya ngokuya iba yinkimbinkimbi, futhi ukwakheka okungavamile kwe-microstructure kanye nokwakheka kwezinto ze-semiconductor kuphazamisa ukuthuthukiswa kwesivuno se-chip, okuletha izinselele ezinkulu ekusetshenzisweni kwe-semiconductor entsha kanye nobuchwepheshe besekethe obuhlanganisiwe.
I-GRGTEST ihlinzeka ngokuhlaziywa kwe-microstructure ye-semiconductor ebanzi kanye nokuhlola ukusiza amakhasimende ukuthuthukisa i-semiconductor nezinqubo zesekethe ezididiyelwe, okuhlanganisa ukulungiswa kwephrofayili yezinga le-wafer nokuhlaziywa kwe-elekthronikhi, ukuhlaziya okuphelele kwezakhiwo zomzimba namakhemikhali wezinto eziphathelene nokukhiqizwa kwe-semiconductor, ukwakhiwa kanye nokuqaliswa kohlelo lokuhlaziya ukungcola kwe-semiconductor.
Ububanzi besevisi
Izinto zokwakha ze-semiconductor, izinto ze-organic ezincane ze-molecule, izinto ze-polymer, i-organic/inorganic hybrid materials, izinto ezingaphili ezingezona ezensimbi
Uhlelo lwesevisi
1. Ukulungiswa kwephrofayili ye-chip wafer level kanye nokuhlaziywa kwe-elekthronikhi, okusekelwe kubuchwepheshe obugxilile be-ion beam (DB-FIB), ukusika okunembile kwendawo yendawo ye-chip, kanye nesithombe se-electronic ngesikhathi sangempela, kungathola isakhiwo sephrofayela ye-chip, ukwakheka kanye nolunye ulwazi olubalulekile lwenqubo;
2. Ukuhlaziywa okuphelele kwezinto ezibonakalayo nezamakhemikhali zezinto zokwakha ze-semiconductor, okuhlanganisa izinto ze-organic polymer, izinto ze-molecule encane, ukuhlaziywa kokwakheka kwezinto ezingezona ezensimbi, ukuhlaziywa kwesakhiwo samangqamuzana, njll.;
3. Ukwakhiwa kanye nokuqaliswa kohlelo lokuhlaziya ukungcola kwezinto zokwakha ze-semiconductor. Kungasiza amakhasimende aqonde ngokugcwele izici ezibonakalayo nezamakhemikhali zokungcola, okuhlanganisa: ukuhlaziya ukwakheka kwamakhemikhali, ukuhlaziya ingxenye yokuqukethwe, ukuhlaziywa kwesakhiwo samangqamuzana nokunye ukuhlaziywa kwezimpawu zomzimba nezamakhemikhali.
Izinto Zesevisi
| Isevisiuhlobo | Isevisiizinto |
| Ukuhlaziywa kokwakheka kwe-elemental kwezinto ze-semiconductor | l Ukuhlaziywa okuyisisekelo kwe-EDS, l Ukuhlaziywa okuyisisekelo kwe-X-ray photoelectron spectroscopy (XPS). |
| Ukuhlaziywa kwesakhiwo se-molecular of semiconductor materials | l Ukuhlaziywa kwe-infrared spectrum ye-FT-IR, l Ukuhlaziywa kwe-X-ray diffraction (XRD), l Ukuhlaziywa kwe-Nuclear magnetic resonance pop (H1NMR, C13NMR) |
| Ukuhlaziywa kwe-Microstructure yezinto zokwakha ze-semiconductor | l Ukuhlaziywa kwesiqephu se-ion egxiliswe kabili (DBFIB), l I-Field emission scanning electron microscopy (FESEM) yasetshenziswa ukukala nokubheka i-microscopic morphology, l I-Atomic force microscopy (AFM) yokuhlola i-surface morphology |
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